TalTech Mektory, Tallinn, Estonia23-25 October 2019

Welcome!

We are pleased to announce the 16th EuroVR International Conference—EuroVR 2019—that will take place in Tallinn, Estonia on 23-25 October, 2019, following Bremen (2014), Lecco (2015), Athens (2016), Laval (2017), and London (2018). This conference series began as part of the INTUITION Network of Excellence in Virtual and Augmented Reality supported by the European Commission from 2004 to 2008 and continued as the Joint Virtual Reality Conferences (JVRC) of EuroVR, EGVE and ICAT from 2009 to 2013. This 2019 conference is being organized by Estonian members of the European Association for Virtual Reality and Augmented Reality (EuroVR), namely the TalTech Mektory team at Tallinn University of Technology.

Technologies

Technologies related to Virtual, Augmented, and Mixed Reality (VR/AR/MR), collaborative and distributed environments, mobile devices, 3D rendering issues, real-time modeling and simulation, multimodal interaction, use cases.

Human factors issues

User studies and evaluation, presence and cognition, 3D user interfaces and interaction metaphors, self-representation and embodiement, virtual humans, sickness and side effects, realism, validity and fidelity, cost effectiveness and efficiency.

Applications

Applications of VR/AR/MR in industry, aerospace and transport, construction and architecture, manufacturing and engineering, medical and rehabilitation, process and product design, training and education, serious gaming and edutainment.

For Scientific track the deadlines are:

  • Scientific Full paper submissions: June 3, 2019 June 28, 2019 23:59 CEST
  • Scientific Poster paper submissions: June 28, 2019 July 3, 2019 23:59 CEST
  • Notification to authors for all Scientific contributions: July 12, 2019 July 19, 2019
  • Camera-ready for accepted Scientific contributions: July 29, 2019 23:59 CEST

For the Application track the deadlines are:

  • Short abstract submissions: Aug 9, 2019
  • Notification to the authors: Sept 6, 2019
  • Camera ready: Sept 13, 2019